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(eBook PDF)3D Microelectronic Packaging From Fundamentals to Applications by Yan Li,Deepak Goyal
$19.90
(eBook PDF)3D Microelectronic Packaging From Fundamentals to Applications by Yan Li,Deepak Goyal
ISBN-13: 9783319445847
ISBN-10: 3319445847
Publisher:Springer; 1st ed. 2017 edition (January 20, 2017)
Author:Yan Li,Deepak Goyal
OCR:OCRed, Searchable
Quality:Good
File Delivery:Sent Via Email in 1-24 hours on working days
This is just ebook, Access Codes or any other Supplements excluded!
US$ 19.90
